设备用途及性能特点

用于树脂及陶瓷结合剂固结磨具磨削层、排屑层的加工。

主要技术指标

●切槽深度：0～100mm

切槽宽度：2～10mm

●切槽形状：根据客户要求定制

Usages and performance characteristics

Used for the processing of grinding layer and dust removal layer of resin and vitrified bond abrasives.

Main technical indicators

● Groove depth：0 ～ 100mm; Groove width：2 ～ 10mm

● Groove shape：customized according to customer requirements