主要特点：
用于LED 行业外延片背减薄加工，稳定配套日本、韩国、中国台湾主流研磨机，可加工2 寸、4 寸、6寸外延片。减薄效率高，表面质量好。砂轮质量稳定，不易深刮、碎片。砂轮寿命高，具有性价比，可大幅降低单片加工成本。砂轮主要性能已达到或超过进口同类产品水平。
加工对象：蓝宝石衬底外延片、SiC 衬底外延片、Si 衬底外延片等。
工件材料：人造蓝宝石、SiC、单晶硅等。
配套研磨机：NTS、WEC、凯勒斯(GALAXY)、创技(SPEEDFAM)、冈本(OKAMOTO) 等。
Characteristics:
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer, Carborundum wafer, GaAs and GaN wafer. This kind of grinding wheel developed in our company can replace imported products. They can be used steadily on the Japanese, Korean grinders with high performance.
Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.
Material of workpiece: Synthetic sapphire, SiC,single crystal silicon.
Grinders: SHUWA , NTS , WEC , GALAXY ,SPEEDFAM , OKAMOTO.
产品规格Specification
