序号 Serial number | 项 目 Project | 参 数 Parameters | 单位 Company |
1 | 有效加热区域 Effective heating area | 长250*宽250*高250 Length 250 * width 250 * height 250 | mm |
2 | 处理基板尺寸 Processing substrate size | ≤250*250*250 ≤Length 250 * width 250 * height 250 | mm |
3 | 工作温度 Maximum operating temperature | 950 | ℃ |
4 | 温度 maximum temperature | 1000 | ℃ |
4 | 均温性(900℃,保温30分钟后测量)Homogenization (900 ℃ for 30 minutes) | ±5 | ℃ |
5 | 控温精度 control accuracy | ±1 | ℃ |
6 | 真空度 vacuum degree | 冷态极限(室温)Cold limit (room temperature) | 优于 6.67 x 10-4 Better than 6.67 x 10-4 | Pa |
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| 工作 (空炉,900℃,保温30min) work (empty furnace, 900 ℃ for 30min) | 优于 6.67 x 10-3 Better than 6.67 x 10-3 | Pa |
7 | 抽气速率(1atm到6.67×10-3Pa) Pumping rate (1atm to 6.67 × 10-3pa) | 主抽阀打开后20min之内 Within 20min after the main extraction valve is opened | / |
9 | 压升率 Pressure rise rate | < 1 | Pa/h |
10 | 升温速率 heating rate | ≤20 | ℃/min |
11 | 温度测量 temperature measurement | 一点控温、一点金属屏温度监控,预留电极法兰口,用于温场测量One point temperature control, one point metal screen temperature monitoring, reserved electrode flange port for temperature field measurement | / |
12 | 均温性测量口Temperature uniformity measuring port | 可带5根热电偶 With 5 thermocouples | / |